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"Samsung and Synopsys have worked closely to validateģDIC Compiler for the foundry's MDI flow, providing our mutualĬustomers with a tapeout-proven platform to optimize their GM and corporate staff for the Silicon Realization Group at Platform from exploration to signoff," said Shankar Krishnamoorthy, Meeting our customers' needs for greater efficiencyĪnd scalability, our pathbreaking innovations in 3DIC Compiler haveĬarved out a lead in 3D silicon realization by delivering a single Multi-die system integration, thus limiting engineering Iterative, with multiple tools and flows needed to achieve "The 3D workflow has traditionally been extremely fragmented and Visualization, pathfinding, exploration, design, implementation, Provide a single, hyper-convergent environment for 3D Model of the highly integrated Synopsys Fusion Design Platform™,Īnd enables multi-die integration co-design and co-analysis to 3DIC Compiler is aĬomplete, end-to-end solution for efficient multi-die design andįull-system integration. They provide end-product modularity andįlexibility to mix and match separate technologies into solutionsĪddressing different market segments or needs. To meet system specifications in terms of PPA, functionality, formįactor and cost. Integrated in a single package-are growing in popularity as a means Multi-die integration -in which many chip dies are stacked and In advanced productivity solutions that reduce turnaround time and Platform is another example of how our close collaboration results Of silicon and advanced packages with Synopsys' 3DIC Compiler Implementation and signoff analysis," said Sangyun Kim, vice president of Foundry Design
#SYNOPSYS MOUNTAIN VIEW FULL#
Optimized multi-die designs through early to full system "Together, Synopsys and Samsung Foundry are easing the way to
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Will be able to productively manage the complexities of 2.5D and 3Dĭesigns, while benefiting from power, performance and area (PPA)Īdvantages and scalability to support hundreds of billions of (Nasdaq: SNPS) today announced that its 3DICĬompiler unified 2.5D and 3D multi-die package co-design andĬo-analysis platform has been qualified for Samsung Foundry's To strengthen innovation of complex SoCs for compute-intensiveĪpplications such as high-performance computing, AI and 5G, Multi-die packaging innovation and productivity for in-demandĪpplications such as HPC, AI, automotive and 5G